5G has just begun commercial use, 6G has already started, and many countries, institutions, and enterprises have begun pre-research work on 6G chip.
Recently, the equipment technology laboratory of the NTT Group in Japan has successfully developed a 6G ultra-high-speed chip. Which uses indium phosphide (InP) compounds and conducted wireless transmission experiments in the 300GHz ultra-high frequency band. When using 16QAM modulation, it achieved 100Gbps Super high speed, equivalent to 100,000 Gigabit wired network.
Also Read: First 5G chipset by MediaTek in 2020
What’s even more amazing is that this high-speed uses only one carrier. If it is supplemented by multi-carrier aggregation and spatial multiplexing technologies such as MIMO and OAM, or if new related technologies are developed in the future. The combination speed will be even worse. The limit expects to reach at least 400Gpbs, which is at least 40 times the speed of 5G today.
Of course, the 28GHz millimeter wave faces the severe test of transmission distance and loss. The 300GHz UHF must overcome more difficulties, and it is destined to only be suitable for short-distance high-speed transmission.
Prior to this, the NCIC Lab at the University of California, Irvine, also developed a transceiver chip beyond 5G, manufactured in a 55nm SiGe BiCMOS process, with an area of 2.5 × 3.5mm, working in the 115-135GHz frequency band, successfully achieving 36Gbps wireless Transmission speed, but the distance is only 30 cm.
As for what 6G will look like, no one knows it. What we have done so far is to explore various possibilities.